Product Innovation Highlights
● Precision Temperature Sensitivity: Rapid foaming within the 120–130°C range, with a volume expansion ratio of up to 60 times. Post-expansion, microspheres break through adhesive layers to achieve "zero-residue" peeling.
● Stress-Adaptive Design: The foaming process absorbs localized heat, compensating for thermal stress deformation and enhancing positioning accuracy of precision components.
● Eco-Friendly Process Compatibility: Certified by RoHS and REACH, meeting green production standards for the electronics industry.
Technology Extension & Market Strategy
The product optimizes shell flexibility by regulating the cross-linking density of microsphere shell materials. Customized technical services support clients in adjusting foaming curves to match production line parameters
"Medium-temperature scenarios demand stringent microsphere response speed and expansion uniformity. This product signifies domestic microspheres' technological alignment in precision manufacturing."
—Head of R&D Center
Sample Requests & Business Cooperation:
Contact: Mr. Zhao
Phone: +86 13326134917
Email: info@feipii.com