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Thermally Expandable Microspheres

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Home Industry Applications Elec. & Semi.
Elec. & Semi.
Precision Polishing Protection & High-Temperature-Resistant Gap Filling
In electronic packaging and semiconductor manufacturing, thermally expandable microspheres achieve precision polishing and zero-residue peeling through controlled expansion. Their low thermal conductivity provides thermal runaway protection for chips, while the closed-cell structure enhances bending resistance in flexible electronic devices. High-temperature-resistant microspheres break through technical bottlenecks, filling application gaps in high-precision electronics.
Application Cases
High-Precision CMP Polishing Pad
Microspheres form a controlled porous structure within the polishing pad, enhancing wafer surface flatness and polishing uniformity, thereby breaking through technical barriers in high-precision semiconductor processes.
Eco-Friendly Thermal Release Adhesive
Microspheres embedded in the adhesive undergo directional thermal expansion, enabling damage-free, zero-residue separation of circuit boards and components. This solves pollution challenges in electronic disassembly and improves dismantling efficiency.
Chip Thermal Management
High-temperature-resistant microspheres construct silicon-based thermal barrier layers. Their low thermal conductivity isolates thermal runaway risks, ensuring sustained stable operation of high-power chips.
Flexible Electronic Substrate
Microspheres enhance the flexibility of polymer molecular chains, improving bending fatigue resistance in hinge areas of foldable screens. This breakthrough overcomes durability bottlenecks in flexible devices.
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Transcending Boundaries, Achieving Together
Feipi specializes in R&D and production of high-performance thermally expandable microspheres. Through independent innovation, we break technological monopolies and reshape material futures with core patents.
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